bq24085, bq24086, bq24087, bq24088

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SLUS784E – DECEMBER 2007 – REVISED DECEMBER 2015

7

Specifications

7.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Supply voltage (IN with respect to Vss)

–0.3

20

Input voltage on IN, STATx, PG, TS, CE, TMR (all with respect to Vss)

–0.3

V(IN)

V

Input voltage on OUT, BAT, ISET (all with respect to Vss)

–0.3

7

V

Output sink current (STATx) + PG

15

mA

Output current (OUT pin)

2

A

Operating free-air temperature

–40

155

°C

Junction temperature

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

The bq24085/6/7/8 family can withstand up to 18 V maximum continuously, 20 V for maximum of 2000 hours and 26 V for a maximum

for 87 hours.

7.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic discharge

V

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

Battery absent detection not functional

3.5

4.35

V

Supply voltage

Battery absent detection functional

4.35

6.5

V

Safety timer program resistor

33

100

K

Ω

Junction temperature

0

125

°C

7.4 Thermal Information

bq2408x

DRC (VSON)

UNIT

10 PINS

Junction-to-ambient thermal resistance

46.7

°C/W

Junction-to-case (top) thermal resistance

65.9

°C/W

Junction-to-board thermal resistance

21.3

°C/W

Junction-to-top characterization parameter

1.6

°C/W

Junction-to-board characterization parameter

21.4

°C/W

Junction-to-case (bottom) thermal resistance

3.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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