TPS731

SBVS034N – SEPTEMBER 2003 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

6

–0.3

6

Voltage

V

–0.3

5.5

–0.3

6

Peak output current

Internally limited

Output short-circuit duration

Indefinite

Continuous total power

See Power Dissipation

dissipation

–55

150

Temperature

°C

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input supply voltage range

1.7

5.5

V

Output current

0

150

mA

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TPS731xx

DBV (SOT-23)

UNIT

5 PINS

Junction-to-ambient thermal resistance

207.2

Junction-to-case (top) thermal resistance

124.2

Junction-to-board thermal resistance

35

°C/W

Junction-to-top characterization parameter

13.5

Junction-to-board characterization parameter

34.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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