TBD62064AFAG

2016-03-08

8

Notes on Contents

1. Pin connection

Pin connection may be simplified for explanatory purpose.

2. Equivalent Circuits

Equivalent circuit may be simplified for explanatory purpose.

3. Timing chart

Timing charts may be simplified for explanatory purposes.

4. Test circuit

Test circuit may be simplified for explanatory purpose.

IC Usage Considerations

Notes on handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a

moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device breakdown, damage or

deterioration, and may result in injury by explosion or combustion.

(2) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of

power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute

maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result

in injury by explosion or combustion. In addition, do not use any device inserted in the wrong orientation or incorrectly

to which current is applied even just once.

(3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of

overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute

maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or

load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the

effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time

and insertion circuit location, are required.

(4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to

prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the

negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or

ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the

protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such

as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as from input

or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a

speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may

cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)

connection-type IC that inputs output DC voltage to a speaker directly.

Points to remember on handling of ICs

Heat Radiation Design

When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is

appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition.

These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,

deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the

effect of IC heat radiation with peripheral components.

Back-EMF

When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power supply

owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power

supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take

the effect of back-EMF into consideration in system design.