Bristol, PA 19007-6810 USA

TEL (215) 781-9956 • FAX (215) 781-9845

PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED

• INFO@ARIESELEC.COM

WWW.ARIESELEC.COM

FEATURES

• Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC

and transistor packages into 0.100 [2.54] pitch proto boards or PC boards.

• Solder masked top-side pads allow user to hand solder devices directly to topside of

adapter with fewer problems of solder bridging.

• Longer male bottom Pins available at special request for easy use of probe clips.

• Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.

GENERAL SPECIFICATIONS

• BOARD MATERIAL: 0.062 [1.58] thick FR-4 manufactured to IPC-600E, Class 2

standards, with 1-oz. Cu traces, both sides

• PADS: HASL

• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni

per SAE-AMS-QQ-N-290

• OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.

18043

Rev. AA

P/N 1110748 Surface Mount-to-DIP JEDEC

SOT-25, SOT-23A-6 Adapter

ORDERING INFORMATION

P/N 1110748

P/N 1110748-P for Panelized Version

CUSTOMIZATION: In addition to the standard products shown

on this page, Aries specializes in custom design and production.

Special materials, platings, sizes, and configurations can be

furnished, depending on the quantity.

NOTE: Aries reserves the

right to change product general specifications without notice.

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

ALL CAC’s ARE MANUFACTURED ND INSPECTED USING IPC -610B

CLASS 2 GUIDELINES

CONSULT FACTORY FOR MOUNTING CONSIDERATIONS OF

CONSIGNED CHIPS.

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS