Thermal

Pad

1

VIN

8

VOUT

2

VIN

7

VOUT

3

ON

6

CT

4

VBIAS

5

GND

3

TPS22965-Q1

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SLVSCI3B – APRIL 2014 – REVISED DECEMBER 2015

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5 Device Comparison Table

DEVICE

QUICK OUTPUT

DISCHARGE

PACKAGE WITH

WETTABLE

FLANKS

MAXIMUM OUTPUT

CURRENT

TEMPERATURE

RANGE

TPS22965-Q1

16 m

Ω

Yes

No

4 A

–40°C to 105°C

TPS22965N-Q1

16 m

Ω

No

No

4 A

–40°C to 105°C

TPS22965W-Q1

16 m

Ω

Yes

Yes

4 A

–40°C to 125°C

TPS22965NW-Q1

16 m

Ω

No

Yes

4 A

–40°C to 125°C

6 Pin Configuration and Functions

DSG Package

8-Pin WSON With Exposed Thermal Pad

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NO.

NAME

1

VIN

I

Pin 1 and Pin 2. See the Application and Implementation section for more information.

2

3

ON

I

Active high switch control input. Do not leave floating.

4

VBIAS

I

Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5 V to

5.5 V. See the Application and Implementation section for more information.

5

GND

—

Device ground

6

CT

O

Switch slew rate control. Can be left floating. See the Application and Implementation section for

more information.

7

VOUT

O

Switch output

8

—

Thermal pad

—

Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See the Layout

section for layout guidelines.