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TPS22965TDSGTQ1 Datasheet(PDF) 4 Page - Texas Instruments

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Part # TPS22965TDSGTQ1
Description  On-Resistance Load Switch
Download  33 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS22965TDSGTQ1 Datasheet(HTML) 4 Page - Texas Instruments

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TPS22965-Q1
SLVSCI3B – APRIL 2014 – REVISED DECEMBER 2015
www.ti.com
Product Folder Links: TPS22965-Q1
Submit Documentation Feedback
Copyright © 2014–2015, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground pin.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT (2)
VIN
Input voltage
–0.3
6
V
VOUT
Output voltage
–0.3
6
V
VBIAS
Bias voltage
–0.3
6
V
VON
On voltage
–0.3
6
V
IMAX
Maximum continuous switch current
4
A
IPLS
Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle
6
A
TJ
Maximum junction temperature
150
°C
TSTG
Storage temperature range
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±4000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1500
(1)
See the Application and Implementation section.
(2)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the
maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package
in the application (RJθA), as given by the following equation: TA(max) = TJ(max) – (RθJA × PD(max))
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIN
Input voltage
0.8
VBIAS
V
VBIAS
Bias voltage
2.5
5.5
V
VON
ON voltage
0
5.5
V
VOUT
Output voltage
VIN
V
VIH
High-level input voltage, ON
VBIAS = 2.5 V to 5.5 V
1.2
5.5
V
VIL
Low-level input voltage, ON
VBIAS = 2.5 V to 5.5 V
0
0.5
V
CIN
Input capacitor
1 (1)
µF
TA
Operating free-air temperature (2)
TPS22965N-Q1, TPS22965-Q1
–40
105
°C
TPS22965NW-Q1, TPS22965W-Q1
–40
125


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