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LM25019MR Datasheet(PDF) 5 Page - Texas Instruments

Part # LM25019MR
Description  100-mA Constant On-Time Synchronous Buck Regulator
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM25019MR Datasheet(HTML) 5 Page - Texas Instruments

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LM25019
www.ti.com
SNVS952E – DECEMBER 2012 – REVISED NOVEMBER 2015
6 Specifications
6.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
VIN, UVLO to RTN
–0.3
53
V
SW to RTN
–1.5
VIN + 0.3
V
SW to RTN (100 ns transient)
–5
VIN + 0.3
V
BST to VCC
53
V
BST to SW
13
V
RON to RTN
–0.3
53
V
VCC to RTN
–0.3
13
V
FB to RTN
–0.3
5
V
Lead Temperature(2)
200
°C
Maximum Junction Temperature(3)
150
°C
Storage temperature, Tstg
–55
150
°C
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which operation of the device is intended to be functional. For specifications and test conditions, see Electrical
Characteristics . The RTN pin is the GND reference electrically connected to the substrate.
(2)
For detailed information on soldering plastic SO Power PAD-8 package, refer to the Packaging Data Book available from Texas
Instruments. Max solder time not to exceed 4 seconds.
(3)
High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±750
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VIN Voltage
7.5
48
V
Operating Junction Temperature(2)
−40
125
°C
(1)
Recommended Operating Conditions are conditions under the device is intended to be functional. For specifications and test conditions,
see Electrical Characteristics.
(2)
High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.
6.4 Thermal Information
LM25019
SO PowerPAD
THERMAL METRICS(1)
WSON NGU
UNIT
DDA
8 PINS
RθJA
Junction-to-ambient thermal resistance
41.3
41.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
3.2
2.4
°C/W
ΨJB
Junction-to-board thermal characteristic parameter
19.2
24.4
°C/W
RθJB
Junction-to-board thermal resistance
19.1
30.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
34.7
37.3
°C/W
ΨJT
Junction-to-top thermal characteristic parameter
0.3
6.7
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
Copyright © 2012–2015, Texas Instruments Incorporated
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