LM74670-Q1

SNOSD08A – SEPTEMBER 2015 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

-3

45

V

-3

42

V

VcapH to VcapL

-0.3

7

V

Anode to VcapL

-0.3

3

V

Gate Drive, Gate Pull Down to VcapL

-0.3

7

V

-40

125

°C

Case Temperature (TC-MAX)

-40

125

°C

-65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

42V continuous (and 45V transients for 2ms) absmax condition from Cathode to Anode. Suitable to use with TVS SMBJ28A and

SMBJ14A at the anode.

(3)

Reverse voltage rating only. There is no positive voltage limitation for the LM74670-Q1 Anode terminal.

(4)

The device performance is ensured over this Ambient Temperature range as long the Case Temperature does not exceed the MAX

value.

6.2 ESD Ratings

VALUE

UNIT

±4000

V

Charged-device model (CDM), per AEC Q100-011

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

(2)

The human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Cathode To Anode

42

V

Ambient Temperature (TA-MAX)

-40

125

°C

Case Temperature (TC-MAX)

125

°C

6.4 Thermal Information

LM74670-Q1

UNIT

VSSOP 8 PINS

Junction-to-ambient thermal resistance

181

Junction-to-case (top) thermal resistance

73

Junction-to-board thermal resistance

102

°C/W

Junction-to-top characterization parameter

11

Junction-to-board characterization parameter

100

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953

4

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