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TLC5927IPWPR Datasheet(PDF) 4 Page - Texas Instruments |
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TLC5927IPWPR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 39 page TLC5926, TLC5927 SLVS677C – JULY 2008 – REVISED OCTOBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VDD Supply voltage 0 7 V VI Input voltage –0.4 VDD + 0.4 V VO Output voltage –0.5 20 V IOUT Output current 120 mA IGND GND terminal current 1920 mA TA Free-air operating temperature range –40 125 °C TJ Operating junction temperature range –40 150 °C Tstg Storage temperature range –55 150 °C 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101 ±500 (2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) TEST CONDITIONS MIN MAX UNIT VDD Supply voltage 3 5.5 V VO Supply voltage to the output pins OUT0–OUT15 17 V VO ≥ 0.6 V 5 IO Output current DC test circuit mA VO ≥ 1 V 120 IOH High-level output current SDO –1 mA IOL Low-level output current SDO 1 mA VIH High-level input voltage CLK, OE(ED2), LE(ED1), and SDI 0.7 × VDD VDD V VIL Low-level input voltage CLK, OE(ED2), LE(ED1), and SDI 0 0.3 × VDD V 7.4 Thermal Information TLC5926, TLC5927 DBQ (SSOP) DW (SOIC) PWP THERMAL METRIC (1) UNIT (HTSSOP) 24 PINS 24 PINS 24 PINS Junction-to-ambient thermal resistance (Mounted on JEDEC 1- 99.8 80.5 63.9 °C/W layer board (JESD 51-3), No airflow) Junction-to-ambient thermal resistance (Mounted on JEDEC 4- RθJA 61 45.5 42.7 °C/W layer board (JESD 51-7), No airflow) Junction-to-ambient thermal resistance (Mounted on JEDEC 4- - - 34.5 °C/W layer board (JESD 51-5), No airflow) RθJC(top) Junction-to-case (top) thermal resistance 49.6 40.8 23.9 °C/W RθJB Junction-to-board thermal resistance 38 40.5 21.6 °C/W ψJT Junction-to-top characterization parameter 13.5 18 0.8 °C/W ψJB Junction-to-board characterization parameter 37.7 40.2 21.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance - - 5.5 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: TLC5926 TLC5927 |
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