TLC5926, TLC5927

SLVS677C – JULY 2008 – REVISED OCTOBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

0

7

V

Input voltage

–0.4

V

Output voltage

–0.5

20

V

Output current

120

mA

GND terminal current

1920

mA

Free-air operating temperature range

–40

125

°C

Operating junction temperature range

–40

150

°C

Storage temperature range

–55

150

°C

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-C101

±500

(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

TEST CONDITIONS

MIN

MAX

UNIT

Supply voltage

3

5.5

V

Supply voltage to the output pins

OUT0–OUT15

17

V

5

Output current

DC test circuit

mA

120

High-level output current

SDO

–1

mA

Low-level output current

SDO

1

mA

High-level input voltage

CLK, OE(ED2), LE(ED1), and SDI

V

Low-level input voltage

CLK, OE(ED2), LE(ED1), and SDI

0

V

7.4 Thermal Information

TLC5926, TLC5927

DBQ (SSOP)

DW (SOIC)

PWP

UNIT

(HTSSOP)

24 PINS

24 PINS

24 PINS

Junction-to-ambient thermal resistance (Mounted on JEDEC 1-

99.8

80.5

63.9

°C/W

layer board (JESD 51-3), No airflow)

Junction-to-ambient thermal resistance (Mounted on JEDEC 4-

61

45.5

42.7

°C/W

layer board (JESD 51-7), No airflow)

Junction-to-ambient thermal resistance (Mounted on JEDEC 4-

-

-

34.5

°C/W

layer board (JESD 51-5), No airflow)

Junction-to-case (top) thermal resistance

49.6

40.8

23.9

°C/W

Junction-to-board thermal resistance

38

40.5

21.6

°C/W

Junction-to-top characterization parameter

13.5

18

0.8

°C/W

Junction-to-board characterization parameter

37.7

40.2

21.4

°C/W

Junction-to-case (bottom) thermal resistance

-

-

5.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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