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TPS3710DSET Datasheet(PDF) 4 Page - Texas Instruments

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Part # TPS3710DSET
Description  Wide VIN Voltage Detector
Download  24 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS3710DSET Datasheet(HTML) 4 Page - Texas Instruments

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TPS3710
SBVS271 – OCTOBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDD
–0.3
20
Voltage(2)
OUT
–0.3
20
V
SENSE
–0.3
7
Current
OUT (output sink current)
40
mA
Operating junction, TJ
–40
125
Temperature
°C
Storage, Tstg
–65
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to network ground pin.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±2500
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VDD
Supply voltage
1.8
18
V
VI
Input voltage
SENSE
0
6.5
V
VO
Output voltage
OUT
0
18
V
6.4 Thermal Information
TPS3710
THERMAL METRIC (1)
DDC (SOT)
DSE (WSON)
UNIT
6 PINS
6 PINS
RθJA
Junction-to-ambient thermal resistance
204.6
194.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
50.5
128.9
°C/W
RθJB
Junction-to-board thermal resistance
54.3
153.8
°C/W
ψJT
Junction-to-top characterization parameter
0.8
11.9
°C/W
ψJB
Junction-to-board characterization parameter
52.8
157.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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