TPS2505

SPAS093C – DECEMBER 2009 – REVISED SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted).

(1) (2)

MIN

MAX

UNIT

Input voltage on SW, AUX, IN, USB, ENUSB, EN, FAULT, ILIM

–0.3

7

V

FAULT sink current

25

mA

ILIM source current

1

mA

–40

125

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Voltages are referenced to GND and PGND tied together.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage at IN

1.8

5.25

V

Supply voltage at IN for start-up

2.2

V

Enable voltage at EN, ENUSB1, ENUSB2, ENLDO

0

5.25

V

Operating free air temperature range

–40

85

°C

Operating junction temperature range

–40

125

°C

6.4 Thermal Information

TPS2505

RGW (VQFN)

UNIT

20 PINS

Junction-to-ambient thermal resistance

34.3

°C/W

Junction-to-case (top) thermal resistance

30

°C/W

Junction-to-board thermal resistance

13.5

°C/W

Junction-to-top characterization parameter

0.4

°C/W

Junction-to-board characterization parameter

13.5

°C/W

Junction-to-case (bottom) thermal resistance

3.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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