LM3648, LM3648TT

SNVSA68B – OCTOBER 2014 – REVISED SEPTEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

IN, SW, OUT, LED

−0.3

6

V

SDA, SCL, TX, TORCH/TEMP, HWEN, STROBE

−0.3

max

Internally limited

150

°C

Maximum lead temperature (soldering)

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

(4)

For detailed soldering specifications and information, refer to Texas Instruments Application Note 1112: DSBGA Wafer Level Chip Scale

Package (SNVA009).

6.2 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

2.5

5.5

V

−40

125

°C

(3)

−40

85

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND terminal.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

6.4 Thermal Information

LM3648

YFF (DSBGA)

UNIT

12 PINS

Junction-to-ambient thermal resistance

90.2

°C/W

Junction-to-case (top) thermal resistance

0.5

°C/W

Junction-to-board thermal resistance

40.0

°C/W

Junction-to-top characterization parameter

3.0

°C/W

Junction-to-board characterization parameter

39.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

Submit Documentation Feedback

Copyright © 2014–2015, Texas Instruments Incorporated

Product Folder Links: LM3648 LM3648TT