TPS259240, TPS259241

www.ti.com

SLVSCU9A – AUGUST 2015 – REVISED AUGUST 2015

7.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)

(1)

TPS25924x

THERMAL METRIC

DRC (VSON)

UNIT

10 PINS

Junction-to-ambient thermal resistance

45.9

Junction-to-case (top) thermal resistance

53

Junction-to-board thermal resistance

21.2

°C/W

Junction-to-top characterization parameter

1.2

Junction-to-board characterization parameter

21.4

Junction-to-case (bottom) thermal resistance

5.9

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5

Electrical Characteristics

–40°C

otherwise noted).

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIN (INPUT SUPPLY)

UVLO threshold, rising

4.15

4.3

4.45

V

5%

Enabled: EN/UVLO = 2 V

0.3

0.42

0.55

mA

Supply current

EN/UVLO = 0 V

0.13

0.225

mA

Over-voltage clamp

13.8

15

16.5

V

EN/UVLO (ENABLE/UVLO INPUT)

EN Threshold voltage, rising

1.37

1.4

1.44

V

EN Threshold voltage, falling

1.32

1.35

1.39

V

EN Input leakage current

0 V

–100

0

100

nA

dV/dT (OUTPUT RAMP CONTROL)

220

nA

dV/dT Discharging resistance

50

73

100

Ω

5.5

V

4.85

V/V

ILIM (CURRENT LIMIT PROGRAMMING)

10

µA

1.02

1.79

2.10

2.42

A

3.46

3.75

4.03

4.5

5.1

5.7

0.84

A

0.73

A

1

1.66

1.98

2.37

A

2.90

3.32

3.85

3.7

4.5

5.5

Fast-Trip comparator level w.r.t.

160%

ILIM Open resistor detect

3.1

V

(1)

These parameters are provided for reference only and do not constitute part of TI's published device specifications for purposes of TI's

product warranty.

(2)

Pulsed testing techniques used during this test maintain junction temperature approximately equal to ambient temperature.

Copyright © 2015, Texas Instruments Incorporated

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