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SN74CBT3383DBR Datasheet(PDF) 4 Page - Texas Instruments |
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SN74CBT3383DBR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page SN74CBT3383, SN54CBT3383 SCDS003P – NOVEMBER 1992 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage –0.5 7 V VI Input voltage(2) –0.5 7 V IO Continuos channel current 128 mA IIK Input clamp current (VI/O<0) –50 mA TJ Junction temperature –65 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 Electrostatic V(ESD) V discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 4.5 5.5 V VIH High-level input voltage 2.0 V VIL Low-level input voltage 0.8 V SN74CBT3383 0 70.0 TA Operating free-air temperature °C SN54CBT3383 –55.0 125.0 6.4 Thermal Information SN74CBT3383 DB DBQ DW PW THERMAL METRIC(1) UNIT (SSOP) (SSOP) (SOIC) (TSSOP) 24 PINS 24 PINS 24 PINS 24 PINS RθJA Junction-to-ambient thermal resistance 63.0 61.0 46.0 88.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 33.5 22.1 19.9 26.5 °C/W RθJB Junction-to-board thermal resistance 32.0 - 19.33 - °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1992–2015, Texas Instruments Incorporated Product Folder Links: SN74CBT3383 SN54CBT3383 |
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