5

TPA3255

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SLASEA8 – FEBRUARY 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

These voltages represents the DC voltage + peak AC waveform measured at the terminal of the device in all conditions.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

–0.3

50

V

VDD to GND

–0.3

13.2

V

–0.3

13.2

V

–0.3

50

V

DVDD to GND

–0.3

4.2

V

AVDD to GND

–0.3

8.5

V

VBG to GND

-0.3

4.2

V

Interface pins

–0.3

50

V

–0.3

62.5

V

OC_ADJ, M1, M2, OSC_IOP, OSC_IOM, FREQ_ADJ, C_START, to GND

–0.3

4.2

V

RESET, FAULT, CLIP_OTW, CLIP to GND

–0.3

4.2

V

INPUT_X to GND

–0.3

7

V

Continuous sink current, RESET, FAULT, CLIP_OTW, CLIP, RESET to

GND

9

mA

Operating junction temperature range

0

150

°C

Storage temperature range

–40

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

±2000

V

Charged device model (CDM), per JEDEC specification

±500

V