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AD9691BCPZ-1250 Datasheet(PDF) 9 Page - Analog Devices |
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AD9691BCPZ-1250 Datasheet(HTML) 9 Page - Analog Devices |
9 / 72 page Data Sheet AD9691 Rev. 0 | Page 9 of 72 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating Electrical AVDD1 to AGND 1.32 V AVDD1_SR to AGND 1.32 V AVDD2 to AGND 2.75 V AVDD3 to AGND 3.63 V DVDD to DGND 1.32 V DRVDD to DRGND 1.32 V SPIVDD to AGND 3.63 V AGND to DRGND −0.3 V to +0.3 V VIN±x to AGND 3.2 V SCLK, SDIO, CSB to AGND −0.3 V to SPIVDD + 0.3 V PDWN/STBY to AGND −0.3 V to SPIVDD + 0.3 V Environmental Operating Temperature Range −40°C to +85°C Maximum Junction Temperature 115°C Storage Temperature Range (Ambient) −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL CHARACTERISTICS Typical θJA, ΨJB, θJC_TOP, and θJC_BOT values are specified vs. the number of printed circuit board (PCB) layers in different airflow velocities (in m/sec). Airflow increases heat dissipation effectively reducing θJA and ΨJB. The use of appropriate thermal management techniques is recommended to ensure that the maximum junction temperature does not exceed the limits shown in Table 7. Table 7. PCB Type Airflow Velocity (m/sec) θJA1,2 ΨJB1,3 θJC_TOP1,4 θJC_BOT1,4 Unit JEDEC 2s2p Board 0.0 17.41 4.70 6.01 1.12 °C/W 1.0 13.83 4.32 N/A5 N/A5 °C/W 2.5 12.47 4.21 N/A5 N/A5 °C/W 1 Per JEDEC 51-7, plus JEDEC 51-5 2s2p test board. 2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per JEDEC JESD51-8 (still air). 4 Per MIL-STD 883, Method 1012.1. 5 N/A means not applicable. ESD CAUTION |
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