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B57350K0102J000 Datasheet(PDF) 9 Page - TDK Electronics |
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B57350K0102J000 Datasheet(HTML) 9 Page - TDK Electronics |
9 / 17 page Solder joint profiles for silver/nickel/tin terminations 1.3.3 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 1.3.4 Notes Iron soldering should be avoided, hot air methods are recommended for repair purposes. Temperature measurement and compensation B57350K Leadless NTCs K350 Page 9 of 17 Please read Cautions and warnings and Important notes at the end of this document. |
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