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AN-1035 Datasheet(PDF) 4 Page - International Rectifier |
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AN-1035 Datasheet(HTML) 4 Page - International Rectifier |
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4 / 42 page  DirectFET ® Technology AN-1035 Board Mounting Application Note www.irf.com Version 28 (revision history), April 2016 Page 4 of 42 Standardized pad layouts Later devices in the DirectFET range use standardized pad outlines (Figure 6). This means that devices of the same can size can easily be interchanged and upgraded. For example, a substrate layout for a small can device with one source pad can be designed to accept a small can device with two source pads; the gate pads are in the same positions on the two devices and the first of two source pads is in the same position as the single source pad. Figure 6 Standardized pad layouts For many devices (see table below), it is possible to use either a device-specific or a universal pad outline on the substrate. The stencil design determines where solder paste is applied to a universal outline. To avoid wastage and flux residues, International Rectified recommends using a device-specific stencil design. Device outline Stencil design Dedicated pad outline Universal pad outline S1 S1 S1 S2 S2 S2 S2 S2 SB SB SB SB M2 M2 M2 M4 M4 M4 M4 M4 L4 L4 L4 L10 L6 L6 L6 L10 L8 L8 L8 L10 Note: L10 is the universal pad layout for large-can devices (Figure 7). All other pad layouts are shown in Appendix A. The device outline code indicates the can size and number of source pads (see table below). Can size Number of source pads S small n – 1, 2, 4, 6, 8 or 10 M medium L large (dimensions in mm) Figure 7(a) L10-outline substrate/PCB layout (dimensions in mm) Figure 7(b) L10-outline substrate/PCB layout Assembly considerations International Rectifier designed DirectFET devices to be as easy as possible to assemble using standard surface mounting techniques. Recessing the die within the package (Figure 8) forces a standoff between die and substrate, which helps to reduce solder balling problems and improves device reliability. However, procedures and conditions can have a profound influence on assembly quality. It is therefore necessary to develop an effective process based on the individual requirements for the application. DirectFET DirectFET PbF Figure 8 Contact planarity |
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