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AN-1035 Datasheet(PDF) 9 Page - International Rectifier |
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AN-1035 Datasheet(HTML) 9 Page - International Rectifier |
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9 / 42 page  DirectFET ® Technology AN-1035 Board Mounting Application Note www.irf.com Version 28 (revision history), April 2016 Page 9 of 42 In Figure 17, the TIM has expanded and separated the silicon die from the device body. Figure 17 Die separated from device body With so many heatsink designs and materials, proposed combinations must be fully evaluated to establish their suitability for a planned application. Reflow equipment DirectFET devices are suitable for assembly using surface mount technology reflowing equipment and are recommended for use with convection, vapor phase and infrared equipment. PbF qualified devices have a good resistance to short-term exposure to high temperatures, making them suitable for reflow profiles of up to 260 oC (measured by attaching a thermocouple to a DirectFET device). There are no special requirements for successful assembly but all reflow processes used in evaluation and qualification complied with the recommendations of solder paste suppliers. Using incorrect reflow profiles can cause solder quality issues such as solder balling, tombstoning (or tilt) and the formation of voids; if such problems arise, the reflow profile should be checked. The DirectFET package is designed to have superior thermal resistance properties. For this reason, it is essential that the core of the substrate reaches thermal equilibrium during the pre-heating stage of the reflow profile to ensure that adequate thermal energy reaches the solder joint. For more information, visit www.irf.com/product-info/directfet/dfmanuengineer.html. Inspection For comprehensive information on inspecting board- mounted DirectFET devices, refer to the DirectFET Inspection Application Note (AN-1080), available at: www.irf.com/technical-info/appnotes/an-1080.pdf As with all chip scale packaging (including land grid arrays and ball grid arrays), the best way to inspect devices after reflow is by taking X-ray images. The images for DirectFET and DirectFET PbF devices will differ slightly, as shown in Figure 19. Figure 19 X-rays of DirectFET (left) and DirectFET PbF An X-ray image of a board-mounted DirectFET PbF device shows denser solder joints, with fewer voids and solder balls, but also with poorer edge definition than seen in DirectFET devices processed under the same conditions. The reason for this is that the solder joints are significantly thicker for the DirectFET PbF devices, which are pre-soldered. As solder tends to adhere more readily to pre-soldered surfaces, the solder joints on the lead-free devices have a more pronounced hour-glass shape. In an X-ray image, this results in blurring of the joint edges and rounding of the joint corners. |
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Similar Description - AN-1035 |
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