
64K x 16 Static RAM
CY7C1021
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
Document #: 38-05054 Rev. **
Revised August 24, 2001
021
Features
• High speed
—tAA = 12 ns
• CMOS for optimum speed/power
• Low active power
— 1320 mW (max.)
• Automatic power-down when deselected
• Independent Control of Upper and Lower bits
• Available in 44-pin TSOP II and 400-mil SOJ
Functional Description
The CY7C1021 is a high-performance CMOS static RAM or-
ganized as 65,536 words by 16 bits. This device has an auto-
matic power-down feature that significantly reduces power
consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is
written into the location specified on the address pins (A0
through A15). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O9 through I/O16) is written into the location
specified on the address pins (A0 through A15).
Reading from the device is accomplished by taking Chip En-
able (CE) and Output Enable (OE) LOW while forcing the write
enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then
data from the memory location specified by the address pins
will appear on I/O1 to I/O8. If Byte High Enable (BHE) is LOW,
then data from memory will appear on I/O9 to I/O16. See the
truth table at the back of this data sheet for a complete descrip-
tion of read and write modes.
The input/output pins (I/O1 through I/O16) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1021 is available in standard 44-pin TSOP Type II
and 400-mil-wide SOJ packages.
WE
Logic Block Diagram
Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
14
31
32
36
35
34
33
37
40
39
38
Top View
SOJ / TSOP II
12
13
41
44
43
42
16
15
29
30
VCC
A15
A14
A13
A12
NC
A4
A3
OE
VSS
A5
I/O16
A2
CE
I/O3
I/O1
I/O2
BHE
NC
A1
A0
1021-2
18
17
20
19
I/O4
27
28
25
26
22
21
23
24
NC
VSS
I/O7
I/O5
I/O6
I/O8
A6
A7
BLE
VCC
I/O15
I/O14
I/O13
I/O12
I/O11
I/O10
I/O9
A8
A9
A10
A11
64K x 16
RAM Array
I/O1 – I/O8
A7
A6
A5
A4
A3
A0
COLUMN DECODER
512 X 2048
DATA IN DRIVERS
OE
A2
A1
I/O9 – I/O16
CE
WE
BLE
BHE
Selection Guide
7C1021-10
7C1021-12
7C1021-15
7C1021-20
Maximum Access Time (ns)
10
12
15
20
Maximum Operating Current (mA)
Commercial
220
220
220
220
Maximum CMOS Standby Current (mA)
Commercial
5
5
5
5
L
0.5
0.5
0.5
0.5
Shaded areas contain preliminary information.