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FDS6670S Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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FDS6670S Datasheet(HTML) 2 Page - Fairchild Semiconductor |
2 / 7 page FDS6670S Rev E (W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = 1 mA 30 V ∆BVDSS ∆T J Breakdown Voltage Temperature Coefficient ID = 1 mA, Referenced to 25 °C 24 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 500 µA IGSSF Gate–Body Leakage, Forward VGS = 20 V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage, Reverse VGS = –20 V, VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = 1 mA 1 2.2 3 V ∆VGS(th) ∆T J Gate Threshold Voltage Temperature Coefficient ID = 1 mA, Referenced to 25 °C –6.2 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = 10 V, ID = 13.5 A VGS = 4.5 V, ID = 11.2 A VGS=10 V, ID =13.5A, TJ=100 °C 7 9.5 9 9 12.5 12.5 m Ω ID(on) On–State Drain Current VGS = 10 V, VDS = 5 V 50 A gFS Forward Transconductance VDS = 10 V, ID = 13.5 A 45 S Dynamic Characteristics Ciss Input Capacitance 2674 pF Coss Output Capacitance 751 pF Crss Reverse Transfer Capacitance VDS = 15 V, V GS = 0 V, f = 1.0 MHz 254 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 11 20 ns tr Turn–On Rise Time 10 20 ns td(off) Turn–Off Delay Time 44 70 ns tf Turn–Off Fall Time VDS = 15 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω 23 37 ns Qg Total Gate Charge 24 34 nC Qgs Gate–Source Charge 7.3 nC Qgd Gate–Drain Charge VDS = 15 V, ID = 13.5 A, VGS = 5 V 6 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current 3.5 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = 3.5 A (Note 2) VGS = 0 V, IS = 7 A (Note 2) 0.4 0.5 0.7 V trr Diode Reverse Recovery Time 26.8 nS Qrr Diode Reverse Recovery Charge IF = 13.5A, diF/dt = 300 A/µs (Note 3) 47.2 nC Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 50°C/W when mounted on a 1 in 2 pad of 2 oz copper b) 105°C/W when mounted on a .04 in 2 pad of 2 oz copper c) 125°C/W when mounted on a minimum pad. |
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