Reliability data

SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a

standardized PCB in accordance with IEC 60539-1.

Test

Standard

Test conditions

∆R

(typical)

Remarks

Storage in

dry heat

IEC

60068-2-2

JIS C 0021

Storage at upper

category temperature

T: (125

±2) °C

t: 1000 h

< 2%

Storage in damp

heat, steady state

IEC

60068-2-78

JIS C 0022

Temperature of air: (40

±2) °C

Relative humidity of air:

(93 +2/ 3)%

Duration: 56 days

< 2%

Rapid temperature

cycling

IEC

60068-2-14

JIS C 0025

Lower test temperature:

55

°C

Upper test temperature: 125

°C

Number of cycles: 100

< 2%

Endurance

T: (65

±2) °C

t: 1000 h

< 2%

Solderability

IEC

60068-2-58

JIS C 0054

Solderability:

(215

±3) °C, (3 ±0.3) s

(245

±5) °C, (3 ±0.3) s

Resistance to soldering heat:

(260

±5) °C, (10 ±1) s

95% of

terminations

wetted

Resistance drift

after soldering

Reflow soldering profile

Wave soldering profile

< 1%

Temperature measurement and compensation

B573**V2

SMD NTC thermistors, case size 0603 (1608)

Standard series

Page 4 of 22

Please read Cautions and warnings and

Important notes at the end of this document.