NCP1339JDR2G datasheet(6/32 Pages) ONSEMI

Part #	NCP1339JDR2G

Description	High-Voltage, QuasiResonant Controller featuring Valley Lock-Out and Power Saving Mode

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Manufacturer	ONSEMI [ON Semiconductor]

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NCP1339

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ELECTRICAL CHARACTERISTICS (VCC = 12 V, VHV = 120 V, VFault = open, VFB = 3 V, VCS = 0 V, VZCD = 0 V, CVCC = 100 nF ,

CDRV = 1 nF, for typical values TJ = 25°C, for min/max values, TJ is – 40°C to 125°C, unless otherwise noted)

Characteristics

Conditions

Symbol

Min

Typ

Max

Unit

STARTUP AND SUPPLY CIRCUITS

Supply Voltage

Startup Threshold

Minimum Operating Voltage

Operating Hysteresis

Transition from Istart1 to Istart2

dV/dt = 0.1 V/ms

VCC increasing

VCC decreasing

VCC(on) − VCC(off)

VCC increasing, IHV = 650 mA

VCC(on)

VCC(off)

VCC(inhibit)

14.0

8.0

5.6

0.55

15.0

9.0

−

1.00

16.0

10.0

−

1.20

V

Blanking Duration After VCC(off)

VCC above VCC(reset)

tUVLO(blank)

2

–

15

ms

Startup Delay

Delay from VCC(on) to QR Enable

tdelay(start)

–

725

ms

Minimum voltage for current source

operation

VHVmin

−

30

60

V

Current flowing out of Vcc

Vcc = 0 V

IC1

−0.8

−0.5

−0.3

mA

Current flowing out of Vcc pin

Vcc = Vcc(on) – 0.5 V

IC2

−15

−10

−6

mA

Off−state leakage current

VHV = 500 V, Vcc = 15 V, VREM = 0 V

Ileak1

−

25.5

mA

HV pin leakage current when PSM is active

VHV = 141 V

Ileak2

−

11

mA

HV pin leakage current when PSM is active

VHV = 325 V

Ileak3

−

18

mA

Vcc level during a fault

VCC(bias)

4.7

5.5

6.3

V

Supply Current

Before Startup, Fault or Latch

Flyback in Skip

switching at 70 kHz

VCC = VCC(on) – 0.5 V

VFB = 0.35 V

CDRV open

ICC2

ICC3

0.05

0.2

1.0

0.10

0.68

1.6

0.54

1.0

3.0

mA

VCC Overvoltage Protection Threshold

VCC(OVP)

27

28

29.5

V

VCC Overvoltage Protection Delay

tdelay(VCC_OVP)

22.5

30.0

37.5

ms

INPUT FILTER DISCHARGE

X2 timer disable switch threshold voltage

Vth_X2

1.0

1.5

2.0

V

Hysteresis on the X2 pin

Vth_X2_hyst

−

150

−

mV

X2 input clamp voltage

V_X2_clamp

−

4

−

V

X2 timer duration

X2_timer

50

−

170

ms

X2 input leakage current

VX2 = 2.5 V

I_X2_leak

−

0.3

mA

Maximum discharge switch current

VCC = 10V

I_X2_dis

7

10

14

mA

REMOTE INPUT – POWER SAVINGS MODE

Remote pin voltage below which PSM is

deactivated

VREM increasing

V_REM_on

1

1.5

2

V

Remote pin voltage above which PSM is

activated

VREM decreasing

V_REM_off

7.2

8

8.8

V

Remote input leakage current

V_REM = 10 V

I_REM_leak

−

20

1000

nA

Remote timer duration

REM_timer

50

−

170

ms

Resistance of the Remote Pin Internal

pull−down Switch

R_SW_REM

1000

−

3000

W

BROWN OUT DETECTION

Brown−Out Start Level

HV pin voltage increasing

VBO(start)

90

101

110

V

System Shutdown Threshold

HV pin voltage decreasing

VBO(stop)

84

93

104

V

Brown−out Detection Blanking Time

VHV decreasing, delay from

VBO(stop) to drive disable

tBO(stop)

30

−

100

ms

GATE DRIVE

Rise Time (10−90%)

VDRV from 10 to 90%

tDRV(rise)

–

40

80

ns

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NCP1339JDR2G Datasheet(PDF) 6 Page - ON Semiconductor

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