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ADS1256IDBR Datasheet(PDF) 2 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation. Click here to check the latest version.
Part # ADS1256IDBR
Description  Very Low Noise, 24-Bit Analog-to-Digital Converter
Download  39 Pages
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Manufacturer  BURR-BROWN [Burr-Brown (TI)]
Direct Link  http://www.burr-brown.com
Logo BURR-BROWN - Burr-Brown (TI)

ADS1256IDBR Datasheet(HTML) 2 Page - Burr-Brown (TI)

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ADS1255
ADS1256
SBAS288D − JUNE 2003 − REVISED AUGUST 2004
www.ti.com
2
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
PACKAGE
MARKING
ORDERING NUMBER
TRANSPORT MEDIA,
QUANTITY
ADS1255
SSOP-20
DB
ADS1255IDB
ADS1255IDBT
Tape and Reel, 250
ADS1255
SSOP-20
DB
ADS1255IDB
ADS1255IDBR
Tape and Reel, 1000
ADS1256
SSOP-28
DB
ADS1256IDB
ADS1256IDBT
Tape and Reel, 250
ADS1256
SSOP-28
DB
ADS1256IDB
ADS1256IDBR
Tape and Reel, 1000
(1) For the most current package and ordering information, refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
ADS1255, ADS1256
UNIT
AVDD to AGND
−0.3 to +6
V
DVDD to DGND
−0.3 to +3.6
V
AGND to DGND
−0.3 to +0.3
V
Input Current
100, Momentary
mA
Input Current
10, Continuous
mA
Analog inputs to AGND
−0.3 to AVDD + 0.3
V
Digital
inputs
DIN, SCLK, CS, RESET,
SYNC/PDWN,
XTAL1/CLKIN to DGND
−0.3 to +6
V
inputs
D0/CLKOUT, D1, D2, D3
to DGND
−0.3 to DVDD + 0.3
V
Maximum Junction Temperature
+150
°C
Operating Temperature Range
−40 to +105
°C
Storage Temperature Range
−60 to +150
°C
Lead Temperature (soldering, 10s)
+300
°C
(1) Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond
those specified is not implied.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.


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