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HSDL1100 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard) |
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HSDL1100 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard) |
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3 / 6 page  3 amplifier for both receiver chan- nels contains daylight cancellation circuitry to eliminate the ambient light portion of incoming Ir signals. Lead Bend Options Lead bend options for the HSDL- 1100 include the TOP (#X08 option), and FRONT (#X07 option). The TOP and FRONT options are similar to that shown on page 13 of the Hewlett-Packard IrDA Design Guide, and are shown in detail on the HSDL-1100 datasheet. The TOP option lies flat on the circuit board, while the FRONT stands upright on the circuit board. Implementation of the HSDL-1100 Required External Components Table 2 describes the external components required for obtaining datasheet performance (Actual values for the components may vary with the I/O chip, controller chip, EnDec chip, or buffer chip that the HSDL-1100 interfaces to). Board Layout Requirements Proper board layout is crucial to the noise immunity of the overall Ir system. Compromised board layout may lead to reduced sesitivity, and therefore shorter achievable Ir link distance. Proper board layout is descibed in detail in page 16 of the Hewlett-Packard IrDA Design Guide. Keys aspects of proper board layout are: •VCC to Gnd bypass capacitor CX5 should be placed within 0.5 cm of the HSDL-1100 module pins 2,4, AND on the same side of the PC board as the HSDL-1100 module. • The PIN bypass capacitor CX1 should be <0.5 cm from pin 1 of the HSDL-1100 module. • A multi-layer PC board should be used, and one layer devoted to a ground plane for the HSDL-1100 module. The ground plane should be laid out as an island, with one connection to a clean (<20 mV noise) system ground or analog system ground, and sepa- rated from the ground connection of fast switching devices, or noise sources. • The board underneath and 1 cm in any direction around the module is defined as the Component Description Recommended Value R1 Txd input resistor for transmitter peaking. 560 Ω ±5%, 0.125 watt RLED (R2) LED bias resistor which sets LED current pulse 4.7 Ω ±5%, 0.5 watt (See Transmitter amplitude. Drive Requirements Section) R3 Power supply noise filter resistor. The higher the 10-50 Ω ±5%, 0.125 watt value, the lower the minimum filter frequency. 1/(R3•CX5) is the minimum filter frequency. CX1 PIN bypass capacitor to reduce noise at the PIN 0.47 µF, ±10%, X7R ceramic, <0.5 cm detector. from pin 1. CX2 Txd input capacitor for transmitter peaking. 220 pF, ±10%, X7R ceramic CX3 Adaptive threshold capacitor. 1000 pF, ±10%, X7R ceramic CX4 Adaptive threshold averaging capacitor. 0.010 µF, ±10%, X7R ceramic CX5 VCC to Gnd bypass capacitor. Should be within 0.47 µF, ±20%, X7R ceramic, <0.5 cm 0.5 cm of module pins 2,4. lead length, within 0.5 cm from pins 2, 4. CX6 VCC to Gnd bypass capacitor. 6.8 µF, Tantalum. Larger value recommended for noisy supplies or environments. CX7 VCC transmitter bypass capacitor 0.47 µF, ceramic. Used to eliminate ripple on VCC caused by the LED current during infrared transmission. Table 2. |
Similar Part No. - HSDL1100 |
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Similar Description - HSDL1100 |
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