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CPC7581BBTR Datasheet(PDF) 11 Page - IXYS Corporation

Part # CPC7581BBTR
Description  Clean, Bounce-Free Switching
Download  15 Pages
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Manufacturer  IXYS [IXYS Corporation]
Direct Link  http://www.ixys.com
Logo IXYS - IXYS Corporation

CPC7581BBTR Datasheet(HTML) 11 Page - IXYS Corporation

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INTEGRATED CIRCUITS DIVISION
CPC7581
R06
www.ixysic.com
11
2.2.1
Make-Before-Break Operation Logic Table (Ringing to Talk Transition)
To use break-before-make ringing switch release
timing, assert TSD during ringing. This causes the
operational sequence shown in “Break-Before-Make
Operation Logic Table (Ringing to Talk Transition)” on
page 11 to occur. Logic states and explanations are
given in “Truth Table” on page 9.
2.2.2
Break-Before-Make Operation Logic Table (Ringing to Talk Transition)
2.3 Data Latch
The CPC7581 has an integrated data latch. The latch
operation is controlled by logic-level input pin 11
(LATCH). The data input of the latch is pin 10
(INRINGING), while the output of the data latch is an
internal node used for state control. When the LATCH
control pin is at logic 0, the data latch is transparent
and data control signals flow directly through to state
control. A change in input will be reflected in a change
is switch state. When the LATCH control pin is at logic
1, the data latch is active and a change in input control
will not affect switch state. The switches will remain in
the position they were in when the LATCH changed
from logic 0 to logic 1 and will not respond to changes
in input as long as the latch is at logic 1. The TSD input
is not tied to the data latch. Therefore, TSD is not
affected by the LATCH input and the TSD input will
override state control.
2.4 TSD
The thermal shutdown mechanism activates when the
device die temperature reaches a minimum of 110° C,
placing the device in the all-off state regardless of
logic input. During thermal shutdown mode, pin 8
(TSD) will read a nominal 0 V. Normal output of TSD is
typically equal to VDD.
If presented with a short duration transient such as a
lightning event, the thermal shutdown feature will
typically not activate. But in an extended power-cross
event, the device temperature will rise and the thermal
shutdown will activate forcing the switches to the all-off
State
INRINGING
Latch
TSD
Timing
Break
Switches
Ringing
Return
Switch
(SW3)
Ringing
Switch
(SW4)
Ringing
1
0Z
-Off
On
On
Make-
Before-
Break
0
SW4 waiting for next zero-current crossing to
turn off. Maximum time is one-half of the ringing
cycle. In this transition state, current that is
limited to the dc break switch current limit value
will be sourced from the ring node of the SLIC.
On
Off
On
Talk
0
Zero-cross current has occurred
On
Off
Off
State
INRINGING
Latch
TSD
Timing
Break
Switches
Ringing
Return
Switch
(SW3)
Ringing
Switch
(SW4)
Ringing
1
0
Z-
Off
On
On
All-off
1
0
Hold this state for one-half of the ringing cycle.
SW4 waiting for zero current to turn off.
Off
Off
On
All-off
1
Zero current has occurred. SW4 has opened
Off
Off
Off
Talk
0
Z
Release break switches
On
Off
Off


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