ADC16DX370RMER datasheet(3/77 Pages) TI1

Part #	ADC16DX370RMER

Description	ADC16DX370 Dual 16-Bit 370 MSPS ADC

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Manufacturer	TI1 [Texas Instruments]

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VINB±

VINB+

VINA±

AGND

VCMB

VINA+

VA3.0

ADC16DX370

(Top View)

1

2

3

4

5

7

6

8

9

10

11

12

EXPOSED PAD ON BOTTOM OF

PACKAGE, PIN 0

AGND

VCMA

AGND

VA3.0

VA1.2

31

32

29

30

34

35

33

36

SA1±

SA1+

SA0±

SA0+

SB1+

SB1±

SB0+

SB0±

AGND

VA1.2

AGND

BP2.5

VA3.0

VA1.8

13

14

39

40

37

38

42

41

AGND

VA1.8

ADC16DX370

www.ti.com

SNVSA18C – APRIL 2014 – REVISED AUGUST 2014

5 Pin Configuration and Functions

WQFN PACKAGE

56 PINS

(TOP VIEW)

Pin Functions

TYPE OR DIAGRAM

DESCRIPTION

NAME

NUMBER

3, 6, 9, 12, 16,

Analog ground

AGND

19, 22, 31, 40,

Analog ground

Must be connected to a solid ground reference plane

49, 52, 55

under the device.

Capacitive bypassing pin for internally regulated 2.5-V

supply

BP2.5

41

Bypass pins

This pin must be decoupled to AGND with a 0.1-

μF

and a 10-µF capacitor located close to the pin.

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ADC16DX370RMER Datasheet(PDF) 3 Page - Texas Instruments

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