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BQ25071QWDQCTQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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BQ25071QWDQCTQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 22 page 4 bq25071-Q1 SLUSCD6 – APRIL 2016 www.ti.com Product Folder Links: bq25071-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground pin unless otherwise noted. 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Input Voltage IN (with respect to GND) –0.3 30 V EN, TS (with respect to GND) –0.3 7 V Output Voltage BAT, OUT, LDO, CHG, ISET (with respect to GND) –0.3 7 V Input Current (Continuous) IN 1.2 A Output Current (Continuous) BAT 1.2 A Output Current (Continuous) LDO 100 mA Output Sink Current CHG 5 mA Junction temperature, TJ –40 150 °C Storage temperature, TSTG –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per aec q100-002(1) ±3000 V Charged-device model (CDM), per AEC Q100-011 ±1000 (1) Charge current may be limited at low input voltages due to the dropout of the device. 7.3 Recommended Operating Conditions MIN MAX UNITS VIN IN operating voltage 3.75 (1) 8 V IIN Input current, IN 1 A IOUT Output Current in charge mode, OUT 1 A TJ Junction Temperature -40 125 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC (1) bq25071-Q1 UNIT DQC (WSON) 10 PINS RθJA Junction-to-ambient thermal resistance 61.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 65.5 RθJB Junction-to-board thermal resistance 22.8 ψJT Junction-to-top characterization parameter 1.5 ψJB Junction-to-board characterization parameter 22.7 RθJC(bot) Junction-to-case (bottom) thermal resistance 5.5 |
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