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bq25071-Q1

SLUSCD6 – APRIL 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage

values are with respect to the network ground pin unless otherwise noted.

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input Voltage

IN (with respect to GND)

–0.3

30

V

EN, TS (with respect to GND)

–0.3

7

V

Output Voltage

BAT, OUT, LDO, CHG, ISET (with respect to GND)

–0.3

7

V

Input Current (Continuous)

IN

1.2

A

Output Current (Continuous)

BAT

1.2

A

Output Current (Continuous)

LDO

100

mA

Output Sink Current

CHG

5

mA

–40

150

°C

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±3000

V

Charged-device model (CDM), per AEC Q100-011

±1000

(1)

Charge current may be limited at low input voltages due to the dropout of the device.

7.3 Recommended Operating Conditions

MIN

MAX

UNITS

IN operating voltage

3.75

(1)

8

V

Input current, IN

1

A

Output Current in charge mode, OUT

1

A

Junction Temperature

-40

125

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.4 Thermal Information

bq25071-Q1

UNIT

DQC (WSON)

10 PINS

Junction-to-ambient thermal resistance

61.6

°C/W

Junction-to-case (top) thermal resistance

65.5

Junction-to-board thermal resistance

22.8

Junction-to-top characterization parameter

1.5

Junction-to-board characterization parameter

22.7

Junction-to-case (bottom) thermal resistance

5.5