bq25100, bq25101, bq25100A, bq25100H, bq25101H, bq25100L

SLUSBV8C – AUGUST 2014 – REVISED NOVEMBER 2014

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7 Specifications

7.1

Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

IN (with respect to VSS)

–0.3

30

V

OUT (with respect to VSS)

–0.3

7

V

Input voltage

PRE-TERM, ISET, TS, CHG

–0.3

7

V

(with respect to VSS)

Input current

IN

300

mA

Output current (continuous)

OUT

300

mA

Output sink current

CHG

15

mA

Junction temperature

–40

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage

values are with respect to the network ground terminal unless otherwise noted.

7.2 Handling Ratings

MIN

MAX

UNIT

ESD

Electrostatic discharge

IN, OUT, TS

1 µF between IN and GND,

8

kV

1 µF between TS and GND,

contact

2 µF between OUT and GND,

15 Air

x5R Ceramic or equivalent

Storage temperature

–65

150

°C

(1)

The test was performed on IC pins that may potentially be exposed to the customer at the product level. The bq2510x IC requires a

minimum of the listed capacitance, external to the IC, to pass the ESD test.

7.3

Recommended Operating Conditions

(1)

MIN

NOM

UNIT

IN voltage range

3.5

28

V

4.45

6.45

V

Input current, IN pin

250

mA

Current, OUT pin

250

mA

Junction temperature

0

125

°C

Programs precharge and termination current thresholds

0.6

30

k

Ω

Fast-charge current programming resistor

0.54

13.5

k

Ω

10k NTC thermistor range without entering BAT_EN or TTDM

1.66

258

k

Ω

(1)

7.4 Thermal Information

bq25100

UNIT

YFP (6 PINS)

Junction-to-ambient thermal resistance

132.9

Junction-to-case (top) thermal resistance

1.3

Junction-to-board thermal resistance

21.8

°C/W

Junction-to-top characterization parameter

5.6

Junction-to-board characterization parameter

21.8

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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Product Folder Links: bq25100 bq25101 bq25100A bq25100H bq25101H bq25100L