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592D107X-004D2-15H Datasheet(PDF) 9 Page - Vishay Siliconix |
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592D107X-004D2-15H Datasheet(HTML) 9 Page - Vishay Siliconix |
9 / 11 page www.vishay.com 82 592D Vishay Sprague Document Number 40004 Revision 20-Oct-04 For technical questions, contact tantalum@vishay.com 3.1 The sum of the peak AC voltage plus the applied DC voltage shall not exceed the DC voltage rating of the capacitor. 3.2 The sum of the negative peak AC voltage plus the applied DC voltage shall not allow a voltage reversal exceeding 10% of the DC working voltage at + 25°C. 4.0 Reverse Voltage: These capacitors are capable of withstanding peak voltages in the reverse direction equal to 10% of the DC rating or 1 volt maximum at +25°C and 5% of the DC voltage rating or 0.5 volt maximum at + 85°C. 5.0 Temperature Derating: If these capacitors are to be operated at temperatures above + 25°C, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown: 6.0 Power Dissipation: Power dissipation will be affected by the heat sinking capability of the mounting surface. Non-sinusoidal ripple current may produce heating effects which differ from those shown. It is important that the equivalent Irms value be established when calculating permissible operating levels. (Power dissipation calculated using + 25°C temperature rise.) Case Code Maximum Permissible Power Dissipation @ + 25 °C (Watts) in free air A B C D R S T U V W X Y 0.060 0.080 0.100 0.125 0.150 0.060 0.080 0.110 0.140 0.175 0.175 0.180 Temperature Derating Factor + 25°C + 85°C + 125°C 1.0 0.9 0.4 7.0 Printed Circuit Board Materials: The capacitors are compatible with most commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE-fluorocarbon and porcelanized steel). If your desired board material is not shown there please contact the Tantalum Marketing Department for assistance in determining compatibility. 8. Attachment: 8.1 Solder Paste: The recommended thickness of the solder paste after application is 0.007" ± .001" [.178mm ± .025mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. 8.2 Soldering: Capacitors can be attached by conventional soldering techniques - convection, infrared reflow, wave soldering and hot plate methods. The Soldering Profile chart shows typical recomended time/temperature conditions for soldering. Attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. The soldering iron must never come in contact with the capacitor. 9.0 Recommended Mounting Pad Geometries: The nib must have sufficient clearance to avoid electrical contact with other components. The width dimension indicated is the same as the maximum width of the capacitor. This is to minimize lateral movement. in inches [millimeters] * Pads for B, C and D case codes are otherwise pad compatible with * Type 293D, B, C and D case codes respectively. REFLOW SOLDER PADS* CASE WIDTH PAD SEPARATION CODE (A) METALIZATION (C) A 0.082 0.085 0.050 [2.1] [1.7] [1.3] B 0.120 0.065 0.065 [3.5] [1.7] [1.7] C 0.130 0.080 0.120 [3.5] [2.3] [3.1] D 0.180 0.080 0.145 [4.6) [2.3] [3.7] R 2.45 0.090 0.145 [8.3] [2.3] [3.7] S 0.067 0.032 0.043 [1.7] [0.8] [1.1] T 0.120 0.065 0.065 [3.5] [1.7] [1.7] U 0.136 0.090 0.120 [3.5] [2.3] [3.1] V 0.180 0.090 0.145 [4.6) [2.3] [3.7] W 0.245 0.090 0.145 [8.3] [2.3] [3.7] X 0.310 0.120 0.360 [7.9] [3.0] [9.2] Y 0.310 0.120 0.360 [7.9] [3.0] [9.2] 250 200 150 100 50 TIME (SECONDS) 0 50 100 150 200 250 300 350 RECOMMENDED REFLOW SOLDERING PROFILE 10.0 Cleaning (Flux Removal) After Soldering: The 592D capacitors are compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. Solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. GUIDE TO APPLICATION (Continued) A B B C |
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