bq27620-G1

www.ti.com

SLUSAE3 – OCTOBER 2012

2

DEVICE INFORMATION

2.1

AVAILABLE OPTIONS

FIRMWARE

TAPE and REEL

PART NUMBER

COMMUNICATION FORMAT

QUANTITY

bq27620YZFR-G1

3000

1.06

CSP-15

–40°C to 85°C

(0x106)

bq27620YZFT-G1

250

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

2.2

THERMAL INFORMATION

bq27620-G1

UNITS

YZF(15 PINS)

Junction-to-ambient thermal resistance

70

Junction-to-case (top) thermal resistance

17

Junction-to-board thermal resistance

20

°C/W

Junction-to-top characterization parameter

1

Junction-to-board characterization parameter

18

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953

Copyright © 2012, Texas Instruments Incorporated

DEVICE INFORMATION

3

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