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BQ771601DPJR Datasheet(PDF) 4 Page - Texas Instruments |
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BQ771601DPJR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 23 page bq771600, bq771601, bq771602 bq771604, bq771605, bq771611, bq771612 SLUSAX0D – DECEMBER 2012 – REVISED JULY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage range(2) VDD–VSS –0.3 30 V Input voltage range(2) V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS –0.3 30 V Output voltage range(2) OUT–VSS –0.3 30 V See package Continuous total power dissipation, PTOT dissipation rating. Functional temperature –40 110 °C Lead temperature (soldering, 10 s), TSOLDER 300 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Absolute maximum ratings for input voltage range, output voltage range, and supply voltage are assured by design and not tested in production. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 VESD Rating V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD (1) Supply voltage 3 20 V V4–V3, V3–V2, V2–V1, V1–VSS, or Input voltage range 0 5 V CD–VSS TA Operating ambient temperature range –40 110 °C (1) See Typical Application. 7.4 Thermal Information bq7716xy THERMAL METRIC(1) DPJ (WSON) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 56.6 °C/W RθJC(top) Junction-to-case(top) thermal resistance 56.4 °C/W RθJB Junction-to-board thermal resistance 30.6 °C/W ψJT Junction-to-top characterization parameter 1.0 °C/W ψJB Junction-to-board characterization parameter 37.8 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance 11.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: bq771600 bq771601 bq771602 bq771604 bq771605 bq771611 bq771612 |
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