PACKAGE OPTION ADDENDUM

www.ti.com

24-Aug-2014

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

5962-9221701MRA

ACTIVE

CDIP

J

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-9221701MR

A

5962-9221702MRA

ACTIVE

CDIP

J

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-9221702MR

A

CY54FCT373ATDM

B

5962-9221703M2A

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

9221703M2A

CY54FCT373ATDMB

ACTIVE

CDIP

J

20

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-9221702MR

A

CY54FCT373ATDM

B

CY74FCT373ATQCT

ACTIVE

SSOP

DBQ

20

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

FCT373A

CY74FCT373ATQCTE4

ACTIVE

SSOP

DBQ

20

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

FCT373A

CY74FCT373ATSOC

ACTIVE

SOIC

DW

20

25

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

FCT373A

CY74FCT373ATSOCG4

ACTIVE

SOIC

DW

20

25

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

FCT373A

CY74FCT373TSOC

ACTIVE

SOIC

DW

20

25

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

FCT373

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.