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HD3SS0001 Datasheet(PDF) 5 Page - Texas Instruments |
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HD3SS0001 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 17 page HD3SS0001 www.ti.com SLAS827 – SEPTEMBER 2013 THERMAL INFORMATION over operating free-air temperature range (unless otherwise noted) HD3SS0001 THERMAL METRIC(1) UNITS 24-PIN VQFN (RLL) θJA Junction-to-ambient thermal resistance 41.5 θJCtop Junction-to-case (top) thermal resistance 43.1 θJCbot Junction-to-case (bottom) thermal resistance 6.3 °C/W θJB Junction-to-board thermal resistance 11.2 ψJT Junction-to-top characterization parameter 1.2 ψJB Junction-to-board characterization parameter 11.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. POWER CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX(1) UNIT IDD Supply Current in Active Mode Outputs Floating 1.0 1.3 mA IDETECT Supply Current in Detect Mode DP_EN# = 1, 10G_EN = 0 26 50 µA PD Power Dissipation in Active Mode 3.3 4.7 mW PDetect Power Dissipation in Detect Mode 80 150 µW (1) The maximum ratings are simulated for VDD = 3.6V. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links :HD3SS0001 |
Similar Part No. - HD3SS0001_14 |
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Similar Description - HD3SS0001_14 |
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