HD3SS0001

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SLAS827 – SEPTEMBER 2013

THERMAL INFORMATION

over operating free-air temperature range (unless otherwise noted)

HD3SS0001

UNITS

24-PIN VQFN (RLL)

Junction-to-ambient thermal resistance

41.5

Junction-to-case (top) thermal resistance

43.1

Junction-to-case (bottom) thermal resistance

6.3

°C/W

Junction-to-board thermal resistance

11.2

Junction-to-top characterization parameter

1.2

Junction-to-board characterization parameter

11.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

POWER CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

UNIT

Supply Current in Active Mode

Outputs Floating

1.0

1.3

mA

Supply Current in Detect Mode

DP_EN# = 1, 10G_EN = 0

26

50

µA

Power Dissipation in Active Mode

3.3

4.7

mW

Power Dissipation in Detect Mode

80

150

µW

(1)

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