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LM317DCYRG3 Datasheet(PDF) 4 Page - Texas Instruments

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Part # LM317DCYRG3
Description  3-Terminal Adjustable Regulator
Download  32 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM317DCYRG3 Datasheet(HTML) 4 Page - Texas Instruments

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LM317
SLVS044W – SEPTEMBER 1997 – REVISED OCTOBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over virtual junction temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VI – VO
Input-to-output differential voltage
40
V
TJ
Operating virtual junction temperature
150
°C
Lead temperature 1,6 mm (1/16 in) from case for 10 s
260
°C
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
MAX
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
2500
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
1000
all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
VO
Output voltage
1.25
7
V
VI – VO
Input-to-output differential voltage
3
40
V
IO
Output current
1.5
A
TJ
Operating virtual junction temperature
0
125
°C
7.4 Thermal Information
LM317
THERMAL METRIC(1)
DCY
KCS
KTT
UNIT
4 PINS
4 PINS
4 PINS
RθJA
Junction-to-ambient thermal resistance
53
19
25.3
RθJC(top)
Junction-to-case (top) thermal resistance
30.6
17
18
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
3
1.94
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
4
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Copyright © 1997–2014, Texas Instruments Incorporated
Product Folder Links: LM317


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