LM2991

SNVS099H – MAY 1999 – REVISED JUNE 2013

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TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Adjust Pin Current

Low Voltage Behavior

Figure 15.

Figure 16.

Maximum Power

Maximum Power Dissipation

Dissipation (TO-220)

Figure 17.

Figure 18.

(1)

of the package (

above 125°C. Excessive power dissipation will cause the LM2991 to go into thermal shutdown (See Thermal Shutdown). For the

LM2991, the junction-to-ambient thermal resistance is 53°C/W for the TO-220, 73°C/W for the DDPAK/TO-263, and junction-to-case

thermal resistance is 3°C/W. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board

copper area thermally connected to the package. Using 0.5 square inches of copper area,

area,

6

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