SN65HVD1470, SN65HVD1471, SN65HVD1473

SN65HVD1474, SN65HVD1476, SN65HVD1477

www.ti.com

SLLSEJ8D – JUNE 2014 – REVISED OCTOBER 2014

7.3 Recommended Operating Conditions

IEC 61000-4-2 ESD (Contact Discharge), bus pins and GND

MIN

NOM

MAX

UNIT

Supply voltage

3

3.3

3.6

V

–7

12

V

High-level input voltage (Driver, driver enable, and receiver enable inputs)

2

V

Low-level input voltage (Driver, driver enable, and receiver enable inputs)

0

0.8

V

Differential input voltage

–12

12

V

Output current, Driver

–60

60

mA

Output current, Receiver

–8

8

mA

Differential load resistance

54

60

Ω

Differential load capacitance

50

pF

HVD1470, HVD1471

400

kbps

Signaling rate

HVD1473, HVD1474

20

Mbps

HVD1476, HVD1477

50

(2)

Operating free-air temperature (See the Application and Implementation for thermal

–40

125

°C

information)

Junction Temperature

–40

150

°C

(1)

The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.

(2)

Operation is specified for internal (junction) temperatures up to 150°C. Self-heating because of internal power dissipation should be

considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which

disables the driver outputs when the junction temperature reaches 170°C.

7.4 Thermal Information — D Packages

THERMAL METRIC

D

D

UNIT

(8 PINS)

(14 PINS)

Junction-to-ambient thermal resistance

110.7

83.3

°C/W

Junction-to-case (top) thermal resistance

54.7

42.9

Junction-to-board thermal resistance

51.3

37.8

Junction-to-top characterization parameter

9.2

9.3

Junction-to-board characterization parameter

50.7

37.5

Thermal shut-down junction temperature

170

°C

7.5 Thermal Information — DGS and DGK Packages

THERMAL METRIC

DGS

DGK

UNIT

(10 PINS)

(8 PINS)

Junction-to-ambient thermal resistance

165.5

168.7

°C/W

Junction-to-case (top) thermal resistance

37.7

62.2

Junction-to-board thermal resistance

86.4

89.5

Junction-to-top characterization parameter

1.4

7.4

Junction-to-board characterization parameter

84.8

87.9

Thermal shut-down junction temperature

170

°C

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