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LM3502 Datasheet(PDF) 4 Page - Texas Instruments

Part # LM3502
Description  Step-Up Converter for White LED Applications
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM3502 Datasheet(HTML) 4 Page - Texas Instruments

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LM3502
SNVS339B – SEPTEMBER 2005 – REVISED MAY 2013
www.ti.com
Absolute Maximum Ratings
(1) (2) (3)
VIN Pin
−0.3V to +5.5V
Sw Pin
−0.3V to +48V
Fb Pin
−0.3V to +5.5V
Cntrl Pin
−0.3V to +5.5V
VOUT1 Pin
−0.3V to +48V
VOUT2 Pin
−0.3V to VOUT1
En1
−0.3V to +5.5V
En2
−0.3V to +5.5V
Continuous Power Dissipation
Internally Limited
Maximum Junction Temperature
(TJ-MAX)
+150°C
Storage Temperature Range
−65°C to +150°C
ESD Rating (4)
Human Body Model:
2 kV
Machine Model:
200V
(1)
All voltages are with respect to the potential at the GND pin.
(2)
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not
apply when operating the device outside of its rated operating conditions.
(3)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4)
The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Conditions
(1) (2)
Junction Temperature (TJ) Range
−40°C to +125°C
Ambient Temperature (TA) Range
−40°C to +85°C
Input Voltage, VIN Pin
2.5V to 5.5V
Cntrl, En1, and En2 Pins
0V to 5.5V
(1)
Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical characteristic specifications do not
apply when operating the device outside of its rated operating conditions.
(2)
All voltages are with respect to the potential at the GND pin.
Thermal Properties
(1)
Junction-to-Ambient Thermal Resistance (
θJA)
DSBGA Package
65°C/W
WQFN Package
49°C/W
(1)
The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance,
θJA, and the ambient temperature, TA. See Thermal Properties for the thermal resistance. The maximum allowable power
dissipation at any ambient temperature is calculated using: PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature. For more information on this topic, please refer toApplication Note 1187: Leadless
Leadframe Package (LLP) and Application Note 1112 for DSBGA chip scale package.
Preliminary Electrical Characteristics
(1) (2)
Limits in standard typeface are for TJ = 25°C. Limits in bold typeface apply over the full operating junction temperature range
(
−40°C ≤ TJ ≤ +125°C). Unless otherwise specified, VIN = 2.5V.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VIN
Input Voltage
2.5
5.5
V
IQ
Non-Switching
Fb > 0.25V
0.5
1
mA
Switching
Fb = 0V, Sw Is Floating
1.9
3
mA
Shutdown
Cntrl = 0V
0.1
3
µA
Low IQ Shutdown
Cntrl = 1.5V, En1 = En2 = 0V
6
15
µA
VFb
Feedback Voltage
0.18
0.25
0.3
V
(1)
All voltages are with respect to the potential at the GND pin.
(2)
Min and Max limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely
norm.
4
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Copyright © 2005–2013, Texas Instruments Incorporated
Product Folder Links: LM3502


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