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MAX3074E Datasheet(PDF) 6 Page - Texas Instruments |
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MAX3074E Datasheet(HTML) 6 Page - Texas Instruments |
6 / 37 page SN65HVD30-EP, SN65HVD31-EP, SN65HVD32-EP SN65HVD33-EP, SN65HVD34-EP, SN65HVD35-EP SGLS367E – SEPTEMBER 2006 – REVISED SEPTEMBER 2015 www.ti.com 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Supply voltage 3 3.6 V VI or VIC Voltage at any bus terminal (separately or common mode) –7(1) 12 V 'HVD30, 'HVD33 25 1/tUI Signaling rate 'HVD31, 'HVD34 5 Mbps 'HVD32, 'HVD35 1 RL Differential load resistance 54 60 Ω VIH High-level input voltage D, DE, RE 2 VCC V VIL Low-level input voltage D, DE, RE 0 0.8 V VID Differential input voltage –12 12 V Driver –60 IOH High-level output current mA Receiver –8 Driver 60 IOL Low-level output current mA Receiver 8 TA Ambient still-air temperature –55 125(2) °C (1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum, is used in this data sheet. (2) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging. 7.4 Thermal Information D (SOIC) D (SOIC) THERMAL METRIC(1) UNIT 8 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 135 92 °C/W RθJC(top) Junction-to-case (top) thermal resistance 43 59 °C/W RθJB Junction-to-board thermal resistance 44 61 °C/W ψJT Junction-to-top characterization parameter 12.1 5.7 °C/W ψJB Junction-to-board characterization parameter 49.7 30.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: SN65HVD30-EP SN65HVD31-EP SN65HVD32-EP SN65HVD33-EP SN65HVD34-EP SN65HVD35-EP |
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