2001 Nov 27

8

Philips Semiconductors

Product specification

UHF power LDMOS transistor

BLF647

handbook, full pagewidth

MGW547

3

8

B2

B1

L2

L1

C9

R1

C2

+Vbias

C5

C1

C3

C6

C7

C8

R2

R3

L16

L15

C18

C19

C16

C14

C13

C12

C11

C10

+VD

R4

L14

C20

C15

C17

95

80

95

Fig.7 Printed-circuit board and component layout for class-AB 600 MHz test circuit.

Dimensions in mm.

The components are situated on one side of the Rogers 5880 printed-circuit board, the other side is unetched and serves as a ground plane.

Earth connections from the component side to the ground plane are made by through metallization.