Product Specification

(.0315”) Q Strip

Revision: C

Date: November 11, 2015

© Samtec, Inc.

Page 6

7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec

does not specify a recommended reflow profile for our connectors. The processing parameters provided by the

solder paste manufacturer should be employed and can usually be found on their website.

All of Samtec

’s surface mount components are lead free reflow compatible and compliant with the profile

parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak

temperature of 260°C as well as 30 seconds above 255°C.

Due to their weight and/or offset center of gravity, right angle (-RA) components cannot be run through the reflow

oven while inverted.

Samtec Recommended Temperature Profile Ranges (SMT)

Sn-Pb Eutectic Assembly

Preheat/Soak

(100°C-150°C)

Max Ramp Up

Rate

Reflow Time

(above 183°C)

Peak

Temp

Time within 5°C

of 235°C

Max Ramp

Down Rate

Time 25°C to

Peak Temp

60-120 sec.

3°C/s max.

40-150 sec.

235°C

20 sec. max.

6°C/s max.

6 min. max.

Pb-Free Assembly

Preheat/Soak

(150°C-200°C)

Max Ramp Up

Rate

Reflow Time

(above 217°C)

Peak

Temp

Time within 5°C

of 260°C

Max Ramp

Down Rate

Time 25°C to

Peak Temp

60-120 sec.

3°C/s max.

40-150 sec.

260°C

30 sec. max.

6°C/s max.

8 min. max.

7.3.1

These guidelines should not be considered design requirements for all applications.

Samtec recommends testing interconnects on your boards in your process to guarantee optimum results.

7.4 Maximum Reflow Passes: Parts can withstand three reflow passes at a peak component temperature of 260°C.