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UCC3952PWTR-4 Datasheet(PDF) 4 Page - Texas Instruments

Part # UCC3952PWTR-4
Description  SINGLE-CELL LITHIUM-LON BATTERY PROTECTION IC
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

UCC3952PWTR-4 Datasheet(HTML) 4 Page - Texas Instruments

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UCC3952-1, UCC3952-2, UCC3952-3, UCC3952-4
SingleCell LithiumIon Battery Protection IC
SLUS400D – AUGUST 2000
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
electrical characteristics, TA = –20°C to 70°C, all voltages are with respect to BNEG (unless
otherwise stated) (continued)
FET switch
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
V
Voltage at PACK
PACK+ > VOV ,
I(SWITCH) = 1 mA to 2 A,
Battery overcharged state switch permits discharge
current only.
100
400
mV
V(PACK–)
Voltage at PACK–
PACK+ = 2.5V,
I(SWITCH) = –1 mA to –2 A,
Battery overdischarged state switch permits charge
current only.
–600
–100
mV
RON
Series resistance of the device
PACK+ = 2.5 V,
In normal mode (when not in OV or UV). This value
includes package and bondwire resistance.
50
75
m
thermal shutdown
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
T(SD)
Thermal shutdown temperature (see Note 2)
135
°C
NOTE 2: This parameter is ensured by design and is not production tested.
detailed description
pin descriptions
BNEG
Connect the negative terminal of the battery to this pin.
PACK+
Connect to the positive terminal of the battery. This pin is available to the user.
CBPS
This power supply bypass pin is connected to PACK+ through an internal 3-k
Ω resistor. An external 0.1-µF
capacitor must be connected between this pin and BNEG.
PACK–
The negative terminal of the battery pack (negative terminal available to the user). The internal FET switch
connects this terminal to the BNEG terminal to give the battery pack user appropriate access to the battery. In
an overcharged state, only discharge current is permitted. In an overdischarged state, only charge current is
permitted.
SUB (DP Package Only)
Do not connect. These pins must be electrically isolated from all other pins. The SUB pins may be soldered to
an isolated copper pad for heatsinking. However, most applications do not require heatsinking.
TCLK
Production test mode pin. This pin is used to provide a high-frequency clock to the IC during production testing.
In an application, this pin is left unconnected or tied to BNEG.


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