Electronic Components Datasheet Search |
|
LMH6715QML Datasheet(PDF) 11 Page - Texas Instruments |
|
LMH6715QML Datasheet(HTML) 11 Page - Texas Instruments |
11 / 18 page 1 2 3 4 5 6 7 8 9 10 100 150 200 250 300 350 400 450 500 GAIN (V/V) LMH6715QML www.ti.com SNOSAQ3B – NOVEMBER 2010 – REVISED MAY 2013 Figure 31. RF vs. Inverting Gain When using the LMH6715 as a replacement for the CLC412, identical bandwidth can be obtained by using an appropriate value of RF . The chart “Frequency Response vs. RF” shows that an RF of approximately 700Ω will provide bandwidth very close to that of the CLC412. At other gains a similar increase in RF can be used to match the new and old parts. CIRCUIT LAYOUT With all high frequency devices, board layouts with stray capacitances have a strong influence over AC performance. The LMH6715 is no exception and its input and output pins are particularly sensitive to the coupling of parasitic capacitances (to AC ground) arising from traces or pads placed too closely (<0.1”) to power or ground planes. In some cases, due to the frequency response peaking caused by these parasitics, a small adjustment of the feedback resistor value will serve to compensate the frequency response. Also, it is very important to keep the parasitic capacitance across the feedback resistor to an absolute minimum. The performance plots in the data sheet can be reproduced using the evaluation boards available from Texas Instruments. The LMH730036 board uses all SMT parts for the evaluation of the LMH6715. The board can serve as an example layout for the final production printed circuit board. Care must also be taken with the LMH6715's layout in order to achieve the best circuit performance, particularly channel-to-channel isolation. The decoupling capacitors (both tantalum and ceramic) must be chosen with good high frequency characteristics to decouple the power supplies and the physical placement of the LMH6715's external components is critical. Grouping each amplifier's external components with their own ground connection and separating them from the external components of the opposing channel with the maximum possible distance is recommended. The input (RIN) and gain setting resistors (RF) are the most critical. It is also recommended that the ceramic decoupling capacitor (0.1 μF chip or radial-leaded with low ESR) should be placed as closely to the power pins as possible. POWER DISSIPATION Follow these steps to determine the Maximum power dissipation for the LMH6715: 1. Calculate the quiescent (no-load) power: PAMP = ICC (VCC - VEE) 2. Calculate the RMS power at the output stage: PO = (VCC -VLOAD)(ILOAD), where VLOAD and ILOAD are the voltage and current across the external load. 3. Calculate the total RMS power: Pt = PAMP + PO The maximum power that the LMH6715, package can dissipate at a given temperature can be derived with the following equation: Pmax = (150º - Tamb)/ θJA where • Tamb = Ambient temperature (°C) • θJA = Thermal resistance, from junction to ambient, for a given package (°C/W) (1) For the CDIP package θJA is 140°C/W. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: LMH6715QML |
Similar Part No. - LMH6715QML_13 |
|
Similar Description - LMH6715QML_13 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |