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LMH6739 Datasheet(PDF) 2 Page - Texas Instruments |
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LMH6739 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 19 page LMH6739 SNOSAD2G – MAY 2004 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) ESD Tolerance (2) Human Body Model 2000V Machine Model 200V Supply Voltage (V+ - V–) 13.2V IOUT (3) Common Mode Input Voltage ±VCC Maximum Junction Temperature +150°C Storage Temperature Range −65°C to +150°C Soldering Information Infrared or Convection (20 sec.) 235°C Wave Soldering (10 sec.) 260°C Storage Temperature Range −65°C to +150°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical Characteristics tables. (2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (3) The maximum output current (IOUT) is determined by device power dissipation limitations. See the Power Dissipation section of the Application Information for more details. Operating Ratings (1) (2) Temperature Range (3) −40°C to +85°C Supply Voltage (V+ - V–) 8V to 12V Thermal Resistance Package ( θJC) ( θJA) 16-Pin SSOP 36°C/W 120°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For specifications, see the Electrical Characteristics tables. (2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (3) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. 2 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMH6739 |
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