TAS5414B-Q1

TAS5424B-Q1

SLOS673

– DECEMBER 2011

www.ti.com

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

PVDD

DC supply voltage range

Relative to GND

–0.3 to 30

V

Pulsed supply voltage range

t

≤ 100 ms exposure

–1 to 50

V

Supply voltage ramp rate

15

V/ms

Externally imposed dc supply current per PVDD or GND pin

±12

A

Pulsed supply current per PVDD pin (one shot)

t

< 100 ms

17

A

Maximum allowed dc current per output pin

±13.5

A

(1)

Pulsed output current per output pin (single pulse)

t

< 100 ms

±17

A

DC or pulsed

±1

mA

Maximum current on MUTE pin

DC or pulsed

±20

mA

Maximum sink current for open-drain pins

7

mA

Input voltage range for pin relative to GND (SCL, SDA,

Supply voltage range:

–0.3 to 6

V

I2C_ADDR pins)

6V

< PVDD < 24 V

Supply voltage range:

Voltage range for MUTE pin relative to GND

–0.3 to 7.5

V

6 V

< PVDD < 24 V

Supply voltage range:

Input voltage range for STANDBY pin

–0.3 to 5.5

V

6 V

< PVDD < 24 V

Supply voltage range:

Input voltage range for OSC_SYNC pin relative to GND

–0.3 to 3.6

V

6 V

< PVDD < 24 V

Maximum voltage between GND pins

±0.3

V

Supply voltage range:

1.9

Vrms

analog input pins

6 V

< PVDD < 24 V

Maximum ac-coupled differential input voltage for

Supply voltage range:

3.8

Vrms

6 V

< PVDD < 24 V

Maximum operating junction temperature range

–55 to 150

°C

Storage temperature range

–55 to 150

°C

(1)

Pulsed current ratings are maximum survivable currents externally applied to the device. High currents may be encountered during

reverse battery, fortuitous open ground, and fortuitous open supply fault conditions.

(2)

See Application Information section for information on analog input voltage and ac coupling.

THERMAL CHARACTERISTICS

PARAMETER

VALUE (Typical)

UNIT

Junction-to-case (heat slug) thermal

1.0

resistance, DKD package

Junction-to-case (heat slug) thermal

1.2

°C/W

resistance, PHD package

Junction-to-ambient thermal resistance

is not specified. See the Thermal Information section.

Exposed pad dimensions, DKD package

13.8

× 5.8

mm

Exposed pad dimensions, PHD package

8

× 8

6

Copyright

© 2011, Texas Instruments Incorporated