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TAS5424BTDKERQ1 Datasheet(PDF) 6 Page - Texas Instruments |
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TAS5424BTDKERQ1 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 46 page TAS5414B-Q1 TAS5424B-Q1 SLOS673 – DECEMBER 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) VALUE UNIT PVDD DC supply voltage range Relative to GND –0.3 to 30 V PVDDMAX Pulsed supply voltage range t ≤ 100 ms exposure –1 to 50 V PVDDRAMP Supply voltage ramp rate 15 V/ms IPVDD Externally imposed dc supply current per PVDD or GND pin ±12 A IPVDD_MAX Pulsed supply current per PVDD pin (one shot) t < 100 ms 17 A IO Maximum allowed dc current per output pin ±13.5 A IO_MAX (1) Pulsed output current per output pin (single pulse) t < 100 ms ±17 A IIN_MAX Maximum current, all digital and analog input pins(2) DC or pulsed ±1 mA IMUTE_MAX Maximum current on MUTE pin DC or pulsed ±20 mA IIN_ODMAX Maximum sink current for open-drain pins 7 mA Input voltage range for pin relative to GND (SCL, SDA, Supply voltage range: VLOGIC –0.3 to 6 V I2C_ADDR pins) 6V < PVDD < 24 V Supply voltage range: VMUTE Voltage range for MUTE pin relative to GND –0.3 to 7.5 V 6 V < PVDD < 24 V Supply voltage range: VSTANDBY Input voltage range for STANDBY pin –0.3 to 5.5 V 6 V < PVDD < 24 V Supply voltage range: VOSC_SYNC Input voltage range for OSC_SYNC pin relative to GND –0.3 to 3.6 V 6 V < PVDD < 24 V VGND Maximum voltage between GND pins ±0.3 V Maximum ac-coupled input voltage for TAS5414B-Q1(2), Supply voltage range: VAIN_AC_MAX_5414 1.9 Vrms analog input pins 6 V < PVDD < 24 V Maximum ac-coupled differential input voltage for Supply voltage range: VAIN_AC_MAX_5424 3.8 Vrms TAS5424B-Q1(2), analog input pins 6 V < PVDD < 24 V TJ Maximum operating junction temperature range –55 to 150 °C Tstg Storage temperature range –55 to 150 °C (1) Pulsed current ratings are maximum survivable currents externally applied to the device. High currents may be encountered during reverse battery, fortuitous open ground, and fortuitous open supply fault conditions. (2) See Application Information section for information on analog input voltage and ac coupling. THERMAL CHARACTERISTICS PARAMETER VALUE (Typical) UNIT Junction-to-case (heat slug) thermal RθJC 1.0 resistance, DKD package Junction-to-case (heat slug) thermal RθJC 1.2 °C/W resistance, PHD package This device is not intended to be used without a heatsink. Therefore, RθJA RθJA Junction-to-ambient thermal resistance is not specified. See the Thermal Information section. Exposed pad dimensions, DKD package 13.8 × 5.8 mm Exposed pad dimensions, PHD package 8 × 8 6 Copyright © 2011, Texas Instruments Incorporated |
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