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LMH6644 Datasheet(PDF) 5 Page - Texas Instruments

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Part # LMH6644
Description  LMH664x Low Power, 130 MHz, 75 mA Rail-to-Rail Output Amplifiers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LMH6644 Datasheet(HTML) 5 Page - Texas Instruments

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LMH6642, LMH6643, LMH6644
www.ti.com
SNOS966Q – MAY 2001 – REVISED SEPTEMBER 2014
7 Specifications
7.1 Absolute Maximum Ratings
(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIN Differential
±2.5
V
Output Short Circuit Duration
See (3) and (4)
Supply Voltage (V+ - V)
13.5
V
V+ +0.8
Voltage at Input/Output pins
V
V
−0.8
Input Current
±10
mA
Junction Temperature(5)
+150
°C
Infrared or Convection Reflow (20 sec)
235
°C
Soldering Information
Wave Soldering Lead Temp.(10 sec)
260
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3)
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4)
Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms.
(5)
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PC board.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
−65
+150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
2000
all pins(2)
Electrostatic
V(ESD)
Machine model (MM)(3)
200
V
discharge(1)
Charged device model (CDM), per JEDEC specification
1000
JESD22-C101, all pins(4)
(1)
Human body model, 1.5 k
Ω in series with 100 pF. Machine Model, 0 Ω in series with 200 pF.
(2)
JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.
(3)
JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process.
(4)
JEDEC document JEP157 states that 1000-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Supply Voltage (V+ – V)
2.7
12.8
V
Operating Temperature Range(2)
−40
+85
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2)
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.
7.4 Thermal Information
LMH6642
LMH6643
LMH6644
THERMAL METRIC(1)
DBV05A
D08A
DGK08A
D14A
PW14A
UNIT
5 PINS
8 PINS
8 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient Thermal Resistance(2)
265
190
235
145
155
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.
Copyright © 2001–2014, Texas Instruments Incorporated
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