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LMH6644 Datasheet(PDF) 5 Page - Texas Instruments |
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LMH6644 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 39 page LMH6642, LMH6643, LMH6644 www.ti.com SNOS966Q – MAY 2001 – REVISED SEPTEMBER 2014 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Differential ±2.5 V Output Short Circuit Duration See (3) and (4) Supply Voltage (V+ - V−) 13.5 V V+ +0.8 Voltage at Input/Output pins V V− −0.8 Input Current ±10 mA Junction Temperature(5) +150 °C Infrared or Convection Reflow (20 sec) 235 °C Soldering Information Wave Soldering Lead Temp.(10 sec) 260 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. (4) Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms. (5) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PC board. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range −65 +150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, 2000 all pins(2) Electrostatic V(ESD) Machine model (MM)(3) 200 V discharge(1) Charged device model (CDM), per JEDEC specification 1000 JESD22-C101, all pins(4) (1) Human body model, 1.5 k Ω in series with 100 pF. Machine Model, 0 Ω in series with 200 pF. (2) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process. (3) JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process. (4) JEDEC document JEP157 states that 1000-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply Voltage (V+ – V−) 2.7 12.8 V Operating Temperature Range(2) −40 +85 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board. 7.4 Thermal Information LMH6642 LMH6643 LMH6644 THERMAL METRIC(1) DBV05A D08A DGK08A D14A PW14A UNIT 5 PINS 8 PINS 8 PINS 14 PINS 14 PINS RθJA Junction-to-ambient Thermal Resistance(2) 265 190 235 145 155 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board. Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LMH6642 LMH6643 LMH6644 |
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