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LMH6646 Datasheet(PDF) 4 Page - Texas Instruments

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Part # LMH6646
Description  LMH664x 2.7 V, 650 關A, 55 MHz, Rail-to-Rail Input and Output Amplifiers with Shutdown Option
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LMH6646 Datasheet(HTML) 4 Page - Texas Instruments

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LMH6645, LMH6646, LMH6647
SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Output short circuit duration
See (3) and (4)
VIN differential
±2.5
V
V+ +0.8,
Voltage at input/output pins
V
V
−0.8
Supply voltage (V+ - V)
12.6
V
Junction temperature(5)
+150
Infrared or Convection (20 sec)
235
°C
Soldering Information
Wave Soldering (10 sec)
260
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3)
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4)
Output short circuit duration is infinite for VS < 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is 1.5
ms.
(5)
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
−65
+150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
2000
pins(1)
V(ESD)
Electrostatic discharge
V
Machine model (MM)(2)
200
(1)
JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process. Human body
model, 1.5 k
Ω in series with 100pF.
(2)
JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process. Machine model, 0
in series with 200 pF.
7.3 Recommended Operating Conditions
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Supply Voltage (V+ – V)
2.5
12
V
Temperature Range(2)
−40
+85
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2)
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PC board.
7.4 Thermal Information
LMH6645
LMH6646
LMH6647
THERMAL METRIC(1)
SOT-23
SOIC-8
VSSOP-8
SOT-23
SOIC-8
UNIT
5 PINS
8 PINS
8 PINS
8 PINS
6 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
265
190
190
235
265
190
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMH6645 LMH6646 LMH6647


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