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LMH6646 Datasheet(PDF) 4 Page - Texas Instruments |
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LMH6646 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 36 page LMH6645, LMH6646, LMH6647 SNOS970D – JUNE 2001 – REVISED NOVEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Output short circuit duration See (3) and (4) VIN differential ±2.5 V V+ +0.8, Voltage at input/output pins V V− −0.8 Supply voltage (V+ - V−) 12.6 V Junction temperature(5) +150 Infrared or Convection (20 sec) 235 °C Soldering Information Wave Soldering (10 sec) 260 (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. (4) Output short circuit duration is infinite for VS < 6 V at room temperature and below. For VS > 6 V, allowable short circuit duration is 1.5 ms. (5) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range −65 +150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2000 pins(1) V(ESD) Electrostatic discharge V Machine model (MM)(2) 200 (1) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process. Human body model, 1.5 k Ω in series with 100pF. (2) JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process. Machine model, 0 Ω in series with 200 pF. 7.3 Recommended Operating Conditions (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply Voltage (V+ – V−) 2.5 12 V Temperature Range(2) −40 +85 °C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ RθJA . All numbers apply for packages soldered directly onto a PC board. 7.4 Thermal Information LMH6645 LMH6646 LMH6647 THERMAL METRIC(1) SOT-23 SOIC-8 VSSOP-8 SOT-23 SOIC-8 UNIT 5 PINS 8 PINS 8 PINS 8 PINS 6 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 265 190 190 235 265 190 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated Product Folder Links: LMH6645 LMH6646 LMH6647 |
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