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THS3202DGNRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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THS3202DGNRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 37 page THS3202 SLOS242F – SEPTEMBER 2002 – REVISED JANUARY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) ORDERABLE PACKAGE AND NUMBER PLASTIC MSOP-8(2) PowerPAD PLASTIC MSOP-8(2) NUMBER OF PLASTIC SOIC-8(2) CHANNELS (D) (DGN) MARKING (DGK) MARKING 2 THS3202D THS3202DGN BEP THS3202DGK BEV (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (that is, THS3202DR). ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. UNIT Supply voltage, VS 16.5 V Input voltage, VI ±VS Differential input voltage, VID ±3 V Output current, IO (2) 175 mA Continuous power dissipation See Package Dissipation Ratings Table Maximum junction temperature, TJ (3) +150°C Maximum junction temperature, continuous operation, long-term reliability, TJ (4) +125°C Operating free-air temperature range, TA –40°C to +85°C Storage temperature range, TSTG –65°C to +150°C HBM 3000 V ESD ratings: CDM 1500 V MM 200 V (1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The THS3202 may incorporate a PowerPAD on the underside of the chip. This acts as a heat sink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about using the PowerPAD thermally-enhanced package. (3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. (4) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. 2 Submit Documentation Feedback Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): THS3202 |
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