3

THS4031, THS4032

www.ti.com

SLOS224H – JULY 1999 – REVISED JUNE 2016

Product Folder Links: THS4031 THS4032

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Copyright © 1999–2016, Texas Instruments Incorporated

(1)

For the most current package and ordering information, see Mechanical, Packaging, and Orderable Information, or see the TI web site

at www.ti.com.

(2)

The D and DGN packages are available taped and reeled. Add an R suffix to the device type (that is, THS4031CDGNR).

(3)

The PowerPAD™ on the underside of the DGN package is electrically isolated from all other pins and active circuitry. Connection to the

PCB ground plane is recommended, although not required, as this copper plane is typically the largest copper plane on the PCB.

5 Device Comparison Table

NUMBER OF

CHANNELS

PACKAGED DEVICES

EVALUATION

MODULE

PLASTIC SMALL

DEVICE

SYMBOL

0°C to 70°C

1

THS4031CD

THS4031CDGN

TIACM

THS4031EVM

2

THS4032CD

THS4032CDGN

TIABD

THS4032EVM

–40°C to 85°C

1

THS4031ID

THS4031IDGN

TIACN

—

2

THS4032ID

THS4032IDGN

TIABG

—

–55°C to 125°C

1

—

—

—

—