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THS6062 Datasheet(PDF) 2 Page - Texas Instruments |
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THS6062 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 46 page THS6002 DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS SLOS202E− JANUARY 1998− REVISED MARCH 2007 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description (continued) The THS6002 is packaged in the patented PowerPAD package. This package provides outstanding thermal characteristics in a small footprint package, which is fully compatible with automated surface mount assembly procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By simply soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from the junction. AVAILABLE OPTIONS PACKAGED DEVICE TA PowerPAD PLASTIC SMALL OUTLINE† (DWP) EVALUATION MODULE 0 °C to 70°C THS6002CDWP THS6002EVM −40 °C to 85°C THS6002IDWP † The DWP packages are available taped and reeled. Add an R suffix to the device type (i.e., THS6002CDWPR) absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC+ to VCC− 33 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, VI (driver and receiver) ±VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current, IO (driver) (see Note 1) 800 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Output current, IO (receiver) (see Note 1) 150 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Differential input voltage, VID (driver and receiver) 6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation at (or below) TA = 25°C (see Note 1) 5.8 W . . . . . . . . . . . . . . . . . . . . . . . . . . Operating free air temperature, TA −40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg −65 °C to 125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature, 1,6 mm (1/16 inch) from case for 10 seconds 300 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The THS6002 incorporates a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermal dissipation plane for proper power dissipation. Failure to do so can result in exceeding the maximum junction temperature, which could permanently damage the device. See the Thermal Information section of this document for more information about PowerPad technology. recommended operating conditions MIN TYP MAX UNIT Supply voltage, VCC+ and VCC − Split supply ±4.5 ±16 V Supply voltage, VCC+ and VCC − Single supply 9 32 V Operating free-air temperature, TA C suffix 0 70 °C Operating free-air temperature, TA I suffix −40 85 °C |
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