THS6002

DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS

SLOS202E− JANUARY 1998− REVISED MARCH 2007

2

POST OFFICE BOX 655303

description (continued)

The THS6002 is packaged in the patented PowerPAD package. This package provides outstanding thermal

characteristics in a small footprint package, which is fully compatible with automated surface mount assembly

procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By simply

soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from the

junction.

AVAILABLE OPTIONS

PACKAGED DEVICE

TA

PowerPAD PLASTIC

SMALL OUTLINE†

(DWP)

EVALUATION

MODULE

0

°C to 70°C

THS6002CDWP

THS6002EVM

−40

°C to 85°C

THS6002IDWP

† The DWP packages are available taped and reeled. Add an R suffix to the

device type (i.e., THS6002CDWPR)

33 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

800 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.8 W

. . . . . . . . . . . . . . . . . . . . . . . . . .

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature, 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The THS6002 incorporates a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermal

dissipation plane for proper power dissipation. Failure to do so can result in exceeding the maximum junction temperature, which could

permanently damage the device. See the Thermal Information section of this document for more information about PowerPad

technology.

recommended operating conditions

MIN

TYP

MAX

UNIT

Supply voltage, VCC+ and VCC −

Split supply

±4.5

±16

V

Supply voltage, VCC+ and VCC −

Single supply

9

32

V

Operating free-air temperature, TA

C suffix

0

70

°C

Operating free-air temperature, TA

I suffix

−40

85

°C